21 February 2014 Patterned mask inspection technology with projection electron microscope technique on extreme ultraviolet masks
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J. of Micro/Nanolithography, MEMS, and MOEMS, 13(1), 013009 (2014). doi:10.1117/1.JMM.13.1.013009
Abstract
High-sensitivity extreme ultraviolet (EUV) mask pattern defect detection is one of the major issues remaining to be addressed in device fabrication using extreme ultraviolet lithography. In order to achieve inspection sensitivity and suitability for the 1× nm node, a projection electron microscope (PEM) system is employed that enables high-speed/high-resolution inspection, which is not possible using conventional deep ultraviolet or electron beam inspection systems. By employing higher electron energy in the electron optics (EO) exposure system and by improving the PEM design, we have minimized the aberration that occurs when working with EO systems and we have improved the transmittance of the system. Experimental results showing the improved transmittance were obtained by making electron throughput measurements. To guarantee the tool’s aptness for 16-nm node EUV mask inspection, corresponding sized programmed defects on masks were designed, and the defect detection sensitivity of the EO system was evaluated. Improvements in image resolution and electron throughput have enabled us to detect 16-nm sized defects. The PEM system was integrated into a pattern inspection system for defect detection sensitivity evaluation.
© 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)
Ryoichi Hirano, Susumu Lida, Tsuyoshi Amano, Tsuneo Terasawa, Hidehiro Watanabe, Masahiro Hatakeyama, Takeshi Murakami, Kenji Terao, "Patterned mask inspection technology with projection electron microscope technique on extreme ultraviolet masks," Journal of Micro/Nanolithography, MEMS, and MOEMS 13(1), 013009 (21 February 2014). https://doi.org/10.1117/1.JMM.13.1.013009
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