21 May 2014 Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining
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Abstract
This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO 2 ) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO 2 layer. Potential applications of these fabricated SiO 2 microstructures in the light-emitting diode industry will be addressed.
© 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)
Kuo-Lun Kao, Cho-Wei Chang, Yung-Chun Lee, "Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining," Journal of Micro/Nanolithography, MEMS, and MOEMS 13(2), 023008 (21 May 2014). https://doi.org/10.1117/1.JMM.13.2.023008 . Submission:
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