6 November 2014 Hybrid metrology: from the lab into the fab
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The accelerated pace of the semiconductor industry in recent years is putting a strain on existing dimensional metrology equipment (such as critical dimension-secondary electron microscopy, atomic force microscopy, scatterometry) to keep up with ever-increasing metrology challenges. However, a revolution appears to be forming with the recent advent of hybrid metrology (HM). We highlight some of the challenges and lessons learned when setting up a standard HM solution and describe the first-in-industry implementation of HM within a high-volume manufacturing environment.
© 2014 Society of Photo-Optical Instrumentation Engineers (SPIE)
Alok Vaid, Alexander Elia, Givantha Iddawela, Cornel Bozdog, Matthew J. Sendelbach, Byungcheol Kang, Paul K. Isbester, Shay Wolfling, "Hybrid metrology: from the lab into the fab," Journal of Micro/Nanolithography, MEMS, and MOEMS 13(4), 041410 (6 November 2014). https://doi.org/10.1117/1.JMM.13.4.041410 . Submission:

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