3 August 2015 Development of lossy and near-lossless compression methods for wafer surface structure digital holograms
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Abstract
Lossy and near-lossless digital hologram compression methods are investigated to compress different complexities of wafer surface structures. In the lossy compression method, we apply row- and column-based uniform downsampling together with spline interpolation, whereas in the near-lossless compression method, we use wavelet local modulus maxima and spline interpolation. Results have shown that the lossy compression method is able to achieve a compression ratio of up to 100 for simpler wafer surface structures than that for complex surface structures. However, the near-lossless compression method is able to yield almost lossless compression even for complex wafer surface structures with a compression of about two. The proposed compression methods are computationally friendly for wafer surface structures as there is no time-consuming iterative computation involved.
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
Hongbo Zhang, Wenjing Zhou, Donald E. Leber, Zhijuan Hu, Xin Yang, Peter W. M. Tsang, Ting-Chung Poon, "Development of lossy and near-lossless compression methods for wafer surface structure digital holograms," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(4), 041304 (3 August 2015). https://doi.org/10.1117/1.JMM.14.4.041304 . Submission:
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