3 August 2015 Development of lossy and near-lossless compression methods for wafer surface structure digital holograms
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Abstract
Lossy and near-lossless digital hologram compression methods are investigated to compress different complexities of wafer surface structures. In the lossy compression method, we apply row- and column-based uniform downsampling together with spline interpolation, whereas in the near-lossless compression method, we use wavelet local modulus maxima and spline interpolation. Results have shown that the lossy compression method is able to achieve a compression ratio of up to 100 for simpler wafer surface structures than that for complex surface structures. However, the near-lossless compression method is able to yield almost lossless compression even for complex wafer surface structures with a compression of about two. The proposed compression methods are computationally friendly for wafer surface structures as there is no time-consuming iterative computation involved.
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
Hongbo Zhang, Hongbo Zhang, Wenjing Zhou, Wenjing Zhou, Donald E. Leber, Donald E. Leber, Zhijuan Hu, Zhijuan Hu, Xin Yang, Xin Yang, Peter W. M. Tsang, Peter W. M. Tsang, Ting-Chung Poon, Ting-Chung Poon, } "Development of lossy and near-lossless compression methods for wafer surface structure digital holograms," Journal of Micro/Nanolithography, MEMS, and MOEMS 14(4), 041304 (3 August 2015). https://doi.org/10.1117/1.JMM.14.4.041304 . Submission:
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