25 February 2016 Architectural strategies in standard-cell design for the 7 nm and beyond technology node
Syed Muhammad Yasser Sherazi, Bharani Chava, Peter Debacker, Marie Garcia Bardon, Pieter Schuddinck, Farshad Firouzi, Praveen Raghavan, Abdelkarim Mercha, Diederik Verkest, Julien Ryckaert
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Abstract
Standard-cell design and characterization are presented for 7-nm CMOS platform technology targeting low-power and high-performance applications with the tightest contacted poly pitch of 42 nm and a metallization pitch of 32 nm in the FinFET technology. Two standard-cell architectures for 7 nm, a 9-track library and a 7.5-track library have been designed, introducing an extra middle-of-line layer to enable an efficient layout of the 7.5-track cells. The 7.5-track cells are on average smaller than the 9-track cells. With the strict design constraints imposed by self-aligned quadruple patterning and self-aligned double patterning, careful design and technology co-optimization is performed.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2016/$25.00 © 2016 SPIE
Syed Muhammad Yasser Sherazi, Bharani Chava, Peter Debacker, Marie Garcia Bardon, Pieter Schuddinck, Farshad Firouzi, Praveen Raghavan, Abdelkarim Mercha, Diederik Verkest, and Julien Ryckaert "Architectural strategies in standard-cell design for the 7 nm and beyond technology node," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(1), 013507 (25 February 2016). https://doi.org/10.1117/1.JMM.15.1.013507
Published: 25 February 2016
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CITATIONS
Cited by 16 scholarly publications and 2 patents.
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KEYWORDS
Optical lithography

Metals

Copper

Resistance

Extreme ultraviolet

Tungsten

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