11 March 2016 Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut process
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Abstract
LELECUT type triple patterning lithography is one of the most promising techniques in 14 nm logic node and beyond. To prevent yield loss caused by overlay error, LELECUT mask assignment, which is tolerant to overlay error, is desired. We propose a method that obtains a LELECUT assignment that is tolerant to overlay error. The proposed method uses positive semidefinite relaxation and randomized rounding technique. In our method, the cost function that takes the length of boundary of features determined by the cut mask into account is introduced.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE)
Yukihide Kohira, Yukihide Kohira, Chikaaki Kodama, Chikaaki Kodama, Tomomi Matsui, Tomomi Matsui, Atsushi Takahashi, Atsushi Takahashi, Shigeki Nojima, Shigeki Nojima, Satoshi Tanaka, Satoshi Tanaka, } "Yield-aware mask assignment by positive semidefinite relaxation in triple patterning using cut process," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(2), 021207 (11 March 2016). https://doi.org/10.1117/1.JMM.15.2.021207 . Submission:
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