27 April 2016 Placement error in directed self-assembly of block copolymers for contact hole application
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Directed self-assembly (DSA) of block copolymers has shown interesting results for contact hole application, as a vertical interconnection access for CMOS sub-10 nm technology. The control of critical dimension uniformity (CDU), defectivity, and placement error (PE) is challenging and depends on multiple processes and material parameters. This paper reports the work done using the 300-mm pilot line available in materials to integrate the DSA process on contact and via level patterning. In the first part, a reliable methodology for PE measurement is defined. By tuning intrinsic edge detection parameters on standard reference images, the working window is determined. The methodology is then implemented to analyze the experimental data. The impact of the planarization process on PE and the importance of PE as a complement of CDU and hole open yield for process window determination are discussed.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE)
Shayma Bouanani, Raluca Tiron, Sandra Bos, Ahmed Gharbi, Patricia Pimenta-Barros, Jérôme Hazart, Frédéric Robert, Céline Lapeyre, Alain Ostrovsky, Cédric Monget, "Placement error in directed self-assembly of block copolymers for contact hole application," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(2), 021407 (27 April 2016). https://doi.org/10.1117/1.JMM.15.2.021407 . Submission:

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