7 December 2016 Low-temperature bonding process for the fabrication of hybrid glass–membrane organ-on-a-chip devices
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Abstract
The integration of microfluidics with living biological systems has paved the way to the exciting concept of “organs-on-a-chip,” which aims at the development of advanced in vitro models that replicate the key features of human organs. Glass-based devices have long been utilized in the field of microfluidics but the integration of alternative functional elements within multilayered glass microdevices, such as polymeric membranes, remains a challenge. To this end, we have extended a previously reported approach for the low-temperature bonding of glass devices that enables the integration of a functional polycarbonate porous membrane. The process was initially developed and optimized on specialty low-temperature bonding equipment (μTAS2001, Bondtech, Japan) and subsequently adapted to more widely accessible hot embosser units (EVG520HE Hot Embosser, EVG, Austria). The key aspect of this method is the use of low temperatures compatible with polymeric membranes. Compared to borosilicate glass bonding (650°C) and quartz/fused silica bonding (1050°C) processes, this method maintains the integrity and functionality of the membrane (Tg 150°C for polycarbonate). Leak tests performed showed no damage or loss of integrity of the membrane for up to 150 h, indicating sufficient bond strength for long-term cell culture. A feasibility study confirmed the growth of dense and functional monolayers of Caco-2 cells within 5 days.
© 2016 Society of Photo-Optical Instrumentation Engineers (SPIE)
Kyall J. Pocock, Xiaofang Gao, Chenxi Wang, Craig Priest, Clive A. Prestidge, Kazuma Mawatari, Takehiko Kitamori, Benjamin Thierry, "Low-temperature bonding process for the fabrication of hybrid glass–membrane organ-on-a-chip devices," Journal of Micro/Nanolithography, MEMS, and MOEMS 15(4), 044502 (7 December 2016). https://doi.org/10.1117/1.JMM.15.4.044502 . Submission:
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