7 February 2017 Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?
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Abstract
We report a systematic study of the feasibility of using directed self-assembly (DSA) in real product design for 7-nm fin field effect transistor (FinFET) technology. We illustrate a design technology co-optimization (DTCO) methodology and two test cases applying both line/space type and via/cut type DSA processes. We cover the parts of DSA process flow and critical design constructs as well as a full chip capable computational lithography framework for DSA. By co-optimizing all process flow and product design constructs in a holistic way using a computational DTCO flow, we point out the feasibility of manufacturing using DSA in an advanced FinFET technology node and highlight the issues in the whole DSA ecosystem before we insert DSA into manufacturing.
© 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
Kafai Lai, Kafai Lai, Chi-Chun Liu, Chi-Chun Liu, Hsinyu Tsai, Hsinyu Tsai, Yongan Xu, Yongan Xu, Cheng Chi, Cheng Chi, Ananthan Raghunathan, Ananthan Raghunathan, Parul Dhagat, Parul Dhagat, Lin Hu, Lin Hu, Oseo Park, Oseo Park, Sunggon Jung, Sunggon Jung, Wooyong Cho, Wooyong Cho, Jaime Morillo, Jaime Morillo, Jed Pitera, Jed Pitera, Kristin Schmidt, Kristin Schmidt, Mike Guillorn, Mike Guillorn, Markus Brink, Markus Brink, Daniel Sanders, Daniel Sanders, Nelson Felix, Nelson Felix, Todd Bailey, Todd Bailey, Matthew Colburn, Matthew Colburn, } "Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?," Journal of Micro/Nanolithography, MEMS, and MOEMS 16(1), 013502 (7 February 2017). https://doi.org/10.1117/1.JMM.16.1.013502 . Submission: Received: 19 November 2016; Accepted: 12 January 2017
Received: 19 November 2016; Accepted: 12 January 2017; Published: 7 February 2017
JOURNAL ARTICLE
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