23 May 2017 Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition
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With the increasing prevalence of complex device integration schemes, trilayer patterning with a solvent strippable hardmask can have a variety of applications. Spin-on metal hardmasks have been the key enabler for selective removal through wet strip when active areas need to be protected from dry etch damage. As spin-on metal hardmasks require a dedicated track to prevent metal contamination and are limited in their ability to scale down thickness without compromising on defectivity, there has been a need for a deposited hardmask solution. Modulation of film composition through deposition conditions enables a method to create TiO 2 films with wet etch tunability. This paper presents a systematic study on development and characterization of plasma-enhanced atomic layer deposited (PEALD) TiO 2 -based hardmasks for patterning applications. We demonstrate lithographic process window, pattern profile, and defectivity evaluation for a trilayer scheme patterned with PEALD-based TiO 2 hardmask and its performance under dry and wet strip conditions. Comparable structural and electrical performance is shown for a deposited versus a spin-on metal hardmask.
© 2017 Society of Photo-Optical Instrumentation Engineers (SPIE)
Anuja De Silva, Anuja De Silva, Indira Seshadri, Indira Seshadri, Kisup Chung, Kisup Chung, Abraham Arceo, Abraham Arceo, Luciana Meli, Luciana Meli, Brock Mendoza, Brock Mendoza, Yasir Sulehria, Yasir Sulehria, Yiping Yao, Yiping Yao, Madhana Sunder, Madhana Sunder, Hoa Truong, Hoa Truong, Shravan Matham, Shravan Matham, Ruqiang Bao, Ruqiang Bao, Heng Wu, Heng Wu, Nelson M. Felix, Nelson M. Felix, Sivananda Kanakasabapathy, Sivananda Kanakasabapathy, "Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition," Journal of Micro/Nanolithography, MEMS, and MOEMS 16(2), 023504 (23 May 2017). https://doi.org/10.1117/1.JMM.16.2.023504 . Submission: Received: 5 March 2017; Accepted: 28 April 2017
Received: 5 March 2017; Accepted: 28 April 2017; Published: 23 May 2017

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