1 January 2003 New atomic force microscopy imaging for an inline large scale integration process monitor
Author Affiliations +
Abstract
New imaging techniques in atomic force microscopy have been developed to suppress bending of the sharpened probe during scanning. After analyzing the bending of the probe, it is clear that the bending is caused by response of servo control and slip of the probe on the slope. It is essential that we do not scan the probe under contact on a sample surface and we approach the surface at a contact force of <10 nN for slip-free operation. The technique controls the probe such that approaching and gap-controlling are done without scanning after the probe has been stepped from pixel to pixel, and the step movement is done after lifting the probe up from the sample surface without servo controlling. This technique permits us to use a very sharpened and slim probe so that we can observe a steep structure, such as a dry-etched groove and hole, and a photoresist pattern with a high aspect ratio faithfully. We clarify that it is possible to apply this technique to monitoring the steep structures with an inline process monitor in the large scale integration process without cracking the wafer.
© (2003) Society of Photo-Optical Instrumentation Engineers (SPIE)
Sumio Hosaka, Sumio Hosaka, Takafumi Morimoto, Takafumi Morimoto, Hiroshi Kuroda, Hiroshi Kuroda, Yasushi Minomoto, Yasushi Minomoto, Yukio Kembo, Yukio Kembo, Hirokazu Koyabu, Hirokazu Koyabu, } "New atomic force microscopy imaging for an inline large scale integration process monitor," Journal of Micro/Nanolithography, MEMS, and MOEMS 2(1), (1 January 2003). https://doi.org/10.1117/1.1530572 . Submission:
JOURNAL ARTICLE
7 PAGES


SHARE
RELATED CONTENT

New AFM imaging for an in-line LSI process monitor
Proceedings of SPIE (July 15 2002)
Cel Resist Processing For Submicron CMOS And Bipolar Circuits
Proceedings of SPIE (December 31 1987)
Sidewall slope sensitivity of CD-AFM
Proceedings of SPIE (September 20 2011)
Dose and focus estimation using top-down SEM images
Proceedings of SPIE (June 01 2003)
Merged CCD/SOI-CMOS technology
Proceedings of SPIE (May 14 2000)

Back to Top