1 January 2004 Heat-resistant photoresists based on new imaging technique: reaction development patterning
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Abstract
Spin-coated films of nonphotosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be clearly imaged with near-UV light. The selected engineering thermoplastics are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems shows good photosensitivity and resolution (line/space 10/10 µm) with about 10 to 15 µm in thickness. Gel-permiation chromatography (GPC) and 1H-NMR measurements that can give information on the structure of components dissolved from the irradiated regions are carried out to make clear the imaging mechanism, which we call reaction development patterning (RDP). RDP-based photosensitive polymers showed high heat resistance up to their glass transition temperature (Tg) or above.
Takafumi Fukushima, Yukiko Kawakami, Akira Kitamura, Toshiyuki Oyama, Masao Tomoi, "Heat-resistant photoresists based on new imaging technique: reaction development patterning," Journal of Micro/Nanolithography, MEMS, and MOEMS 3(1), (1 January 2004). https://doi.org/10.1117/1.1633273
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