1 January 2004 Improvement of current distribution uniformity on substrates for microelectromechanical systems
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Abstract
The employment of an insulating shield for the improvement of the current distribution on 3-in. wafer substrates is considered. Numerical analysis is used to evaluate the influence of shield shape and position on the deposition uniformity, and the simulation results are compared to experimental data for nickel deposition from a Ni sulfamate bath. The use of a shield is shown to be an effective and simple way to improve current distribution uniformity, reducing the measured disparity between the average current density and the current density at the substrate center from ~35% to less than about 10% for the cases studied.
© (2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Jong-Min Lee, Jong-Min Lee, John T. Hachman, John T. Hachman, James J. Kelly, James J. Kelly, Alan C. West, Alan C. West, } "Improvement of current distribution uniformity on substrates for microelectromechanical systems," Journal of Micro/Nanolithography, MEMS, and MOEMS 3(1), (1 January 2004). https://doi.org/10.1117/1.1631924 . Submission:
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