Extreme ultraviolet (EUV) lithography has emerged as the most likely successor to 193-nm lithography. We provide a technical overview of EUV lithography and a discussion of the advantages of EUV lithography over alternative technologies. The key challenges in developing EUV exposure tools for high-volume production are discussed. A brief assessment is given of the cost of ownership of EUV lithography in comparison with 193-nm immersion lithography.
Peter J. Silverman,
"Extreme ultraviolet lithography: overview and development status," Journal of Micro/Nanolithography, MEMS, and MOEMS 4(1), 011006 (1 January 2005). https://doi.org/10.1117/1.1862647