1 January 2005 Extreme ultraviolet lithography: overview and development status
Author Affiliations +
J. of Micro/Nanolithography, MEMS, and MOEMS, 4(1), 011006 (2005). doi:10.1117/1.1862647
Abstract
Extreme ultraviolet (EUV) lithography has emerged as the most likely successor to 193-nm lithography. We provide a technical overview of EUV lithography and a discussion of the advantages of EUV lithography over alternative technologies. The key challenges in developing EUV exposure tools for high-volume production are discussed. A brief assessment is given of the cost of ownership of EUV lithography in comparison with 193-nm immersion lithography.
Peter J. Silverman, "Extreme ultraviolet lithography: overview and development status," Journal of Micro/Nanolithography, MEMS, and MOEMS 4(1), 011006 (1 January 2005). http://dx.doi.org/10.1117/1.1862647
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KEYWORDS
Extreme ultraviolet

Extreme ultraviolet lithography

Reticles

Photomasks

Lithography

EUV optics

Deep ultraviolet

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