1 January 2005 Blazed silicon gratings fabricated by deflecting crystal orientation (111) silicon wafer
Author Affiliations +
J. of Micro/Nanolithography, MEMS, and MOEMS, 4(1), 019701 (2005). doi:10.1117/1.1857533
Abstract
Bulk silicon wet etching can be used to fabricate silicon gratings. Wet etching depends on the anisotropic property of monocrystalline silicon. Blazed gratings for different spectral ranges can be fabricated by this method, and facets of grooves are formed by crystallographic planes of the monocrystalline silicon wafer. We develop a method to fabricate blazed gratings using deflecting crystal orientation (111) silicon wafers. The topographies of the samples are measured by SEM and atomic force microscopy (AFM), and the results indicate that the samples have grooves of good uniformity and facets of excellent optical quality.
Hui Ju, Ping Zhang, Jingqiu Liang, Shurong Wang, YiHui Wu, "Blazed silicon gratings fabricated by deflecting crystal orientation (111) silicon wafer," Journal of Micro/Nanolithography, MEMS, and MOEMS 4(1), 019701 (1 January 2005). http://dx.doi.org/10.1117/1.1857533
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KEYWORDS
Silicon

Semiconducting wafers

Diffraction gratings

Crystals

Scanning electron microscopy

Wet etching

Atomic force microscopy

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