1 October 2005 Multifunctional interferometric platform for on-chip testing the micromechanical properties of MEMS/MOEMS
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Abstract
We develop a multifunctional interferometric platform for testing MEMS/MOEMS, measuring 3-D out-of-plane deflections and providing both material properties and motion behavior of microdevices. Specific metrology procedures are demonstrated to determine respectively the residual stress of silicon membranes compressively prestressed by SiOxNy plasma-enhanced chemical vapor deposition (PECVD), the vibration modes of PZT microactuators, as well as the expertise of scratch drive actuators.
© (2005) Society of Photo-Optical Instrumentation Engineers (SPIE)
Christophe Gorecki, Christophe Gorecki, Michal Józwik, Michal Józwik, Leszek A. Salbut, Leszek A. Salbut, } "Multifunctional interferometric platform for on-chip testing the micromechanical properties of MEMS/MOEMS," Journal of Micro/Nanolithography, MEMS, and MOEMS 4(4), 041402 (1 October 2005). https://doi.org/10.1117/1.2110027 . Submission:
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