1 January 2007 Impact of photoacid generator leaching on optics photocontamination in 193-nm immersion lithography
Vladimir Liberman, Mordechai Rothschild, Stephen T. Palmacci, Andrew Grenville
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Abstract
Leaching of resist components into water has been reported in several studies. Even low dissolution levels of photoacid generator (PAG) may lead to photocontamination of the last optical surface of the projection lens. To determine the impact of this phenomenon on optics lifetime, we initiate a set of controlled studies, where predetermined amounts of PAG are introduced into pure water and the results monitored quantitatively. The study identifies the complex, nonlinear paths leading to photocontamination of the optics. We also discover that spatial contamination patterns of the optics are strongly dependent on the flow geometry. Both bare SiO2 surfaces as well as coated CaF2 optics are studied. We find that for all surfaces, at concentrations typical of leached PAG, below 500 ppb, the in situ self-cleaning processes prevent contamination of the optics.
©(2007) Society of Photo-Optical Instrumentation Engineers (SPIE)
Vladimir Liberman, Mordechai Rothschild, Stephen T. Palmacci, and Andrew Grenville "Impact of photoacid generator leaching on optics photocontamination in 193-nm immersion lithography," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(1), 013001 (1 January 2007). https://doi.org/10.1117/1.2712841
Published: 1 January 2007
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Contamination

Immersion lithography

Laser irradiation

Optical components

Wafer-level optics

Diffusion

In situ metrology

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