1 July 2007 Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter
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We report the influence of bonding temperature on SU-8 to SU-8 bonding and report fabrication of a hybrid microelectromechanical-tunable filter (MEM-TF) using SU-8 bond pads. We demonstrate use of 2-μm-thick 50×50-μm2 SU-8 bond pads to attach 4.92-μm-thick 250×250-μm2 Al0.4Ga0.6As-GaAs distributed Bragg reflectors (DBR) to polysilicon MUMPs® piston actuators. Advantages of this process include compatibility with hydrofluoric-acid-release chemistry, low-temperature/low-pressure bonding, simple bond-pad photolithography, 57% flip-bonded DBR yield, and 30% electrostatically actuatable hybrid MEM-TF yield.
Edward M. Ochoa, Lavern A. Starman, Robert G. Bedford, Thomas R. Nelson, James E. Ehret, Michael Harvey, Travis Anderson, Fan Ren, "Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 033007 (1 July 2007). https://doi.org/10.1117/1.2767326

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