1 July 2007 Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter
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Abstract
We report the influence of bonding temperature on SU-8 to SU-8 bonding and report fabrication of a hybrid microelectromechanical-tunable filter (MEM-TF) using SU-8 bond pads. We demonstrate use of 2-μm-thick 50×50-μm2 SU-8 bond pads to attach 4.92-μm-thick 250×250-μm2 Al0.4Ga0.6As-GaAs distributed Bragg reflectors (DBR) to polysilicon MUMPs® piston actuators. Advantages of this process include compatibility with hydrofluoric-acid-release chemistry, low-temperature/low-pressure bonding, simple bond-pad photolithography, 57% flip-bonded DBR yield, and 30% electrostatically actuatable hybrid MEM-TF yield.
© (2007) Society of Photo-Optical Instrumentation Engineers (SPIE)
Edward M. Ochoa, Edward M. Ochoa, Lavern A. Starman, Lavern A. Starman, Robert G. Bedford, Robert G. Bedford, Thomas R. Nelson, Thomas R. Nelson, James E. Ehret, James E. Ehret, Michael Harvey, Michael Harvey, Travis Anderson, Travis Anderson, Fan Ren, Fan Ren, } "Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 033007 (1 July 2007). https://doi.org/10.1117/1.2767326 . Submission:
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