1 July 2007 Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter
Author Affiliations +
J. of Micro/Nanolithography, MEMS, and MOEMS, 6(3), 033011 (2007). doi:10.1117/1.2778431
Abstract
It is convenient to characterize thin film material properties using commercially available nanoindentation systems. This study aims to discuss several considerations while determining the thin film elastic modulus by means of a microcantilever bending test using a commercial nanoindentation system. The measurement results are significantly improved after: 1. the indentation of the film during the test is considered and corrected, and 2. the boundary effects are considered in the model by finite element method. In application, the elastic modulus of electroplating nickel film 11 μm thick was characterized.
Changchun Hsu, Chingfu Tsou, Weileun Fang, "Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter," Journal of Micro/Nanolithography, MEMS, and MOEMS 6(3), 033011 (1 July 2007). http://dx.doi.org/10.1117/1.2778431
JOURNAL ARTICLE
7 PAGES


SHARE
KEYWORDS
Thin films

Nickel

Silicon

Etching

Finite element methods

Electroplating

Microelectromechanical systems

Back to Top