1 October 2008 Low-temperature wet-release process for low stiffness structures
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J. of Micro/Nanolithography, MEMS, and MOEMS, 7(4), 043007 (2008). doi:10.1117/1.2990733
Abstract
A low-temperature wet-release process for low stiffness structures fabricated using material of low Young's modulus has been developed and presented. The release process is described in the light of different forces that cause stiction during release. This technique is successfully demonstrated for different low stiffness structures with gold as the membrane material and positive photoresist or SiO2 as the sacrificial layer.
Jaibir Sharma, Amitava DasGupta, "Low-temperature wet-release process for low stiffness structures," Journal of Micro/Nanolithography, MEMS, and MOEMS 7(4), 043007 (1 October 2008). http://dx.doi.org/10.1117/1.2990733
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KEYWORDS
Gold

Liquids

Electrodes

Silicon

Etching

Microelectromechanical systems

Semiconducting wafers

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