Low-temperature wet-release process for low stiffness structures

Jaibir Sharma; Amitava DasGupta

doi:10.1117/1.2990733

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1 October 2008 Low-temperature wet-release process for low stiffness structures

Jaibir Sharma, Amitava DasGupta

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J. of Micro/Nanolithography, MEMS, and MOEMS, 7(4), 043007 (2008). https://doi.org/10.1117/1.2990733

Abstract

A low-temperature wet-release process for low stiffness structures fabricated using material of low Young's modulus has been developed and presented. The release process is described in the light of different forces that cause stiction during release. This technique is successfully demonstrated for different low stiffness structures with gold as the membrane material and positive photoresist or SiO₂ as the sacrificial layer.

©(2008) Society of Photo-Optical Instrumentation Engineers (SPIE)

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Jaibir Sharma and Amitava DasGupta "Low-temperature wet-release process for low stiffness structures," Journal of Micro/Nanolithography, MEMS, and MOEMS 7(4), 043007 (1 October 2008). https://doi.org/10.1117/1.2990733

Published: 1 October 2008

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