1 July 2009 Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS
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J. of Micro/Nanolithography, MEMS, and MOEMS, 8(3), 031301 (2009). doi:10.1117/1.3236753
Abstract
This PDF file contains the editorial “Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS” for JM3 Vol. 8 Issue 03
Rajeshuni Ramesham, Allyson Hartzell, "Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS," Journal of Micro/Nanolithography, MEMS, and MOEMS 8(3), 031301 (1 July 2009). http://dx.doi.org/10.1117/1.3236753
Submission: Received ; Accepted
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KEYWORDS
Reliability

Packaging

Microopto electromechanical systems

Microelectromechanical systems

Nanofabrication

New and emerging technologies

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