1 October 2010 Special Section Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II
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J. of Micro/Nanolithography, MEMS, and MOEMS, 9(4), 041101 (2010). doi:10.1117/1.3533418
Abstract
This PDF file contains the editorial “Special Section Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II” for JM3 Vol. 9 Issue 04
Rajeshuni Ramesham, "Special Section Guest Editorial: Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II," Journal of Micro/Nanolithography, MEMS, and MOEMS 9(4), 041101 (1 October 2010). http://dx.doi.org/10.1117/1.3533418
Submission: Received ; Accepted
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KEYWORDS
Packaging

Reliability

Microelectromechanical systems

Microopto electromechanical systems

Deformable mirrors

Dielectric breakdown

Sensors

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