1 January 2010 Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis
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This PDF file contains the errata for “JM3 Vol. 9 Issue 01 Paper 3314279” for JM3 Vol. 9 Issue 01
© (2010) Society of Photo-Optical Instrumentation Engineers (SPIE)
Valeriy Sukharev, Valeriy Sukharev, Ara Markosian, Ara Markosian, Armen Kteyan, Armen Kteyan, Levon Manukyan, Levon Manukyan, Nikolay Khachatryan, Nikolay Khachatryan, Jun-Ho Choy, Jun-Ho Choy, Hasmik Lazaryan, Hasmik Lazaryan, Henrik Hovsepyan, Henrik Hovsepyan, Seiji Onoue, Seiji Onoue, Takuo Kikuchi, Takuo Kikuchi, Tetsuya Kamigaki, Tetsuya Kamigaki, } "Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis," Journal of Micro/Nanolithography, MEMS, and MOEMS 9(1), 019801 (1 January 2010). https://doi.org/10.1117/1.3314279 . Submission:
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