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1 April 2010 Lifting angle of polyimide self-assembly surface-micromachined structure
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This study presents a polyimide (PI) self-assembly technique for developing a 3-D surface-micromachined structure. The effects of geometric factors and curing temperatures of PI elastic joints on the lifting angles of such 3-D microstructures are investigated. Under the optimized curing condition (380°C), a maximum 74-deg lifting angle of 5.2×10−11 kg-weight polysilicon microplate is achieved utilizing a large thermal shrinkage force of a single PI joint. Before severe cross-linkage occurred (curing at 390 to 400°C), the lifting angle of the thermally actuated 3-D microstructure is nearly in direct proportion to the length/width-thickness ratio of the PI joint (with linearity of 95.5%) and the difference between curing and room temperatures (with linearity of 92.3 to 97%). The PI-based self-assembly process is very suitable for mass production due to its high yield of fabrication (80 to 91.6%) and high compatibility with the present IC and MEMS manufacturing processes.
©(2010) Society of Photo-Optical Instrumentation Engineers (SPIE)
I-Yu Huang, Yen-Chi Lee, Chang-Yu Lin, and Pin-En Ho "Lifting angle of polyimide self-assembly surface-micromachined structure," Journal of Micro/Nanolithography, MEMS, and MOEMS 9(2), 023006 (1 April 2010).
Published: 1 April 2010

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