Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Jakob Gakkestad; Per Dalsjo; Helge Kristiansen; Rolf Johannessen; Maaike M. Visser Taklo

doi:10.1117/1.3504691

1 October 2010 Use of conductive adhesive for MEMS interconnection in ammunition fuze applications

Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, Maaike M. Visser Taklo

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 9, Issue 4, 041108 (October 2010). https://doi.org/10.1117/1.3504691

Abstract

A novel conductive adhesive is used to interconnect MEMS test structures with different pad sizes directly to a printed circuit board (PCB) in a medium caliber ammunition fuze. The fuze environment is very demanding, with a setback acceleration exceeding 60,000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures perform well when subjected to rapid temperature cycling according to military-standard 883G method 1010.8 test condition B. The test structures pass 100 temperature cycles, followed by a firing test where the test structures are exposed to an acceleration of more than 60,000 g.

©(2010) Society of Photo-Optical Instrumentation Engineers (SPIE)

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Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, and Maaike M. Visser Taklo "Use of conductive adhesive for MEMS interconnection in ammunition fuze applications," Journal of Micro/Nanolithography, MEMS, and MOEMS 9(4), 041108 (1 October 2010). https://doi.org/10.1117/1.3504691

Published: 1 October 2010

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KEYWORDS

Adhesives

Optical spheres

Resistance

Microelectromechanical systems

Independent component analysis

Particles

Polymers

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