21 April 2015 High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes
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Abstract
This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications.
© 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
Che-Hsuan Huang, Kuo-Ju Chen, Ming-Ta Tsai, Min-Hsiung Shih, Chia-Wei Sun, Wei-I Lee, Chien-Chung Lin, Hao-Chung Kuo, "High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes," Journal of Photonics for Energy 5(1), 057606 (21 April 2015). https://doi.org/10.1117/1.JPE.5.057606 . Submission:
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