7 March 2013 Optical-electrical printed wiring board for high-speed computing applications
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Abstract
Optical-electrical printed wiring boards were fabricated featuring mechanical transfer (MT)-compatible interconnections for out-of-plane optical signal routing with an average optical link loss of 10.7 dB. Commercially available components were integrated into an optical layer for out-of-plane optical routing, including light turning devices that feature spherical micro lens arrays, a total internal reflection mirror, and alignment slots compatible with standard MT connectors. The feasibility of the optical-electrical printed wiring board is discussed in detail to demonstrate its compatibility with common printed circuit board manufacturing processes. The optical-electrical printed wiring board prototypes survived thermal cycling (−40°C to 85°C) and humidity exposure (95% humidity) showing an overall degradation of <3  dB of optical performance. Operational failure (<18  dB ) occurred after environmental aging life testing at 110°C for 216 h.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE) 0091-3286/2013/$25.00 © 2013 SPIE
Joseph Dingeldein, Kevin L. Kruse, Casey D. Demars, Christopher T. Middlebrook, Craig R. Friedrich, and Michael C. Roggemann "Optical-electrical printed wiring board for high-speed computing applications," Optical Engineering 52(3), 035201 (7 March 2013). https://doi.org/10.1117/1.OE.52.3.035201
Published: 7 March 2013
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Waveguides

Optics manufacturing

Optical alignment

Epoxies

Connectors

Prototyping

Humidity

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