Heterodyne hologram interferometry was used to study load-deformation characteristics of computer microcomponents that were surface mounted on a printed circuit board. The board was assembled as a cantilever plate and subjected to cyclic flexure loading according to industry standards. The flexure loading was sinusoidal at 0.1 cps with an amplitude of 1.25 mm (0.050 in.) at the tip of the board. Double-exposure heterodyne holograms were recorded under a number of conditions specified by the magnitude of deflection at the board's tip and the number of accumulated flexure cycles. Data obtained during reconstruction of heterodyne holograms were used to compute displacements and strains along the leads connecting the component to the printed circuit board. The experimental results show that lead displacements were on the order of 1.2 um, while strains were up to 0.054%. The results obtained in this study will be used as input to finite element models of computer microcomponents.