There is a growing demand to increase the throughput of high speed processors and computers. To meet this demand, denser and higher speed integrated circuits and new computing architectures are being developed. IElectrical interconnects and switching have been identified as bottlenecks to the throughput of computing systems. Two trends brought on by the need for faster computing systems have pushed the requirements on various levels of interconnects to the edge of what is possible with conventional interconnects. The first trend is the development of higher speed and denser switching devices in silicon and gallium arsenide. Switching speeds of logic devices are now exceeding 1 Gb/s, and high density integration has resulted in the need for interconnect technologies to handle hundreds of output pins. The second trend is the development of new architectures for increasing the parallelism and, hence, the throughput of a computing system.