Total internal reflection holography permits high-resolution, noncontact lithography over very large fields. A production lithographic system has been constructed employing specially developed illumination, focus, and alignment subsystems integrated onto a 6-in. substrate-handling mechanism. The system achieves an imaging resolution of 0.25 μm with a present overlay capability of ± 0.5 μm. A fine alignment system under development has demonstrated a 50-nm measurement accuracy. The technology is well suited to many applications, including the manufacture of flat panel displays, surlace acoustic wave devices, integrated optics, and optical storage disks.