1 March 1993 Microcreep deformation measurements by a moiré method using electron beam lithography and electron beam scan
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Optical Engineering, 32(3), (1993). doi:10.1117/12.61046
Abstract
Microcreep deformations in pure copper specimens are studied by a new moiré method. In this method, a fine micrograting prepared by electron beam lithography is used as a model grating, and a scanning exposure ofthe primary electron beam in a scanning electron microscope (SEM) as a master grating. The scanning exposure of the electron beam on the specimen with the model grating produces moiré fringes of bright and dark lines formed in response to the different amounts of the emitted secondary electrons for each primary electron. This new method makes it possible to obtain a clear and fine moiré fringe without an image-processing system and to observe the moiré fringe pattern and the SEM image at the same time. By this method, the inhomogeneous microcreep deformations such as grain boundary sliding, coarse slip, and localized strain are measured with high accuracy. It is confirmed that the creep strain is nonuniform even in the same grain and the strain distribution is caused mainly by the grain boundary sliding.
Satoshi Kishimoto, Mitsuru Egashira, Norio Shinya, "Microcreep deformation measurements by a moiré method using electron beam lithography and electron beam scan," Optical Engineering 32(3), (1 March 1993). http://dx.doi.org/10.1117/12.61046
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KEYWORDS
Moire patterns

Scanning electron microscopy

Electron beams

Copper

Fringe analysis

Electron beam lithography

Metals

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