1 December 1996 Laser microsoldering of tape-automated bonding leads using an Nd:YAG laser end-pumped by a laser diode bar with gradient index lens array coupling
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Optical Engineering, 35(12), (1996). doi:10.1117/1.601084
Abstract
A laser soldering of tape-automated bonding (TAB) leads is tried with a diode-pumped Nd:YAG laser. A 15-W laser diode bar, a multistripe monolithic laser diode array, is used to end-pump Nd:YAG. Twelve beams emitted from 12 stripes, center-to-center spaced 800 ?m, of a 1-cm linear diode array were collimated by a lens array of width 1 cm, consisting of 12 gradient-index (GRIN) lenses with 800-?m width, to pump the Nd:YAG facet. The maximum Nd:YAG output power at 1064 nm of 6.3 W is obtained in cw operation. The Nd:YAG laser beam is focused to a spot with a FWHM diameter of 112337 ?m. A TAB device with 215-?m-width leads, center-to-center spaced 430 ?m, is successfully soldered by 98-ms irradiation of the laser power of 5.8 W/lead. Soldering is tried with a fiber-coupled Nd:YAG output as well.
Satoshi Yamaguchi, Koichi Chiba, Yoshimasa Saito, Tetsuro Kobayashi, "Laser microsoldering of tape-automated bonding leads using an Nd:YAG laser end-pumped by a laser diode bar with gradient index lens array coupling," Optical Engineering 35(12), (1 December 1996). http://dx.doi.org/10.1117/1.601084
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KEYWORDS
Semiconductor lasers

Nd:YAG lasers

Lead

Laser welding

Laser bonding

GRIN lenses

Mirrors

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