1 October 1997 High-speed optical three-dimensional scanner for automatic solder joint inspection
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Abstract
The optical principle of a high-speed three-dimensional scanner that can operate at high and medium resolution was developed on the basis of confocal microscopy. It was shown that 3-D detection of surfaces, essentially independent of surface characteristics such as inclination and reflectivity, is feasible. Shading effects were found to be negligible. A data rate of 2 Mpixel/s and a 3-D resolution of 5 to 15 µm at 150-mm to 1.5-mm height range were achieved. In a factory a highresolution scanner has been operating successfully for automatic solder joint inspection of multichip modules since 1994. Also, a mediumresolution system for solder joint inspection of surface-mounted devices was developed and evaluated. In view of their high inspection reliability, the developed 3-D inspection systems promise to be a powerful tool for use in production lines.
Richard Schneider, Anton Schick, Paul Koellensperger, Takanori Ninomiya, "High-speed optical three-dimensional scanner for automatic solder joint inspection," Optical Engineering 36(10), (1 October 1997). https://doi.org/10.1117/1.601412 . Submission:
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