1 May 1997 Optoelectronic multichip modules for high-speed computer systems and communication networks
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The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes.
Seungug Koh, Seungug Koh, Daniel J. Sadler, Daniel J. Sadler, Chong Hyuk Ahn, Chong Hyuk Ahn, } "Optoelectronic multichip modules for high-speed computer systems and communication networks," Optical Engineering 36(5), (1 May 1997). https://doi.org/10.1117/1.601345 . Submission:


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