Optoelectronic multichip modules for high-speed computer systems and communication networks

Seungug Koh; Daniel J. Sadler; Chong Hyuk Ahn

doi:10.1117/1.601345

Abstract

The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes.

Citation Download Citation

Seungug Koh, Seungug Koh, Daniel J. Sadler, Daniel J. Sadler, Chong Hyuk Ahn, Chong Hyuk Ahn, } "Optoelectronic multichip modules for high-speed computer systems and communication networks," Optical Engineering 36(5), (1 May 1997). https://doi.org/10.1117/1.601345 . Submission:

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