infrared thermal detectors were prepared with pyroelectric PSN-PT-PZ (1/47/52) ceramics, where a signal electrode had a structure Au/metallic buffer/Pb(Zr,Ti)O3 ceramic. The effect of a metallic buffer layer on the voltage responsivity was investigated with a response to a step signal, made by a dynamic pyroelectric measurement. A pyroelectric ceramic wafer was prepared by a mixed-oxide technique. The Au layer (thickness 50 nm) and the metallic buffers (thickness 0 to 20 nm) of Cr, NiCr (80 : 20), and Ti were prepared by dc magnetron sputtering. In order to improve the light absorptivity, Au black was coated on the Au signal electrode by thermal evaporation. A detector without a buffer layer showed a noisy and fluctuating output signal. Among the three kinds of buffer materials, NiCr (80 : 20) and Ti adhered well with ceramics and showed good electrical and thermal contacts, whereas Cr resulted in bad contacts. Considering the output voltage and thermal properties, the optimum thickness of the buffer layer was about 15 to 20 nm, and sensors with a Ti buffer 15 to 20 nm in thickness showed good detectivity. Thus, the stability and reliability of the infrared thermal sensors could be improved by using an appropriate buffer layer.