Submicron holes in copper thin film directly ablated using femtosecond pulsed laser

B. K. A. Ngoi; Krishnan Venkatakrishnan; Beng Heok Tan

doi:10.1117/1.1419024

1 December 2001 Submicron holes in copper thin film directly ablated using femtosecond pulsed laser

B. K. A. Ngoi, Krishnan Venkatakrishnan, Beng Heok Tan

Optical Engineering, Vol. 40, Issue 12, (December 2001). https://doi.org/10.1117/1.1419024

The ability to machine very small features in material has a wide range of applications in semiconductor microelectronics, such as laser dye etching of ICs. Femtosecond-pulse laser pulses have been shown to hold great potential for high-precision micromachining. The extremely short duration of a femtosecond pulse highly limits heat diffusion, resulting in clean and defect-free ablation, making highprecision micromachining achievable.

©(2001) Society of Photo-Optical Instrumentation Engineers (SPIE)

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B. K. A. Ngoi, Krishnan Venkatakrishnan, and Beng Heok Tan "Submicron holes in copper thin film directly ablated using femtosecond pulsed laser," Optical Engineering 40(12), (1 December 2001). https://doi.org/10.1117/1.1419024

Published: 1 December 2001

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