1 December 2001 Submicron holes in copper thin film directly ablated using femtosecond pulsed laser
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Optical Engineering, 40(12), (2001). doi:10.1117/1.1419024
Abstract
The ability to machine very small features in material has a wide range of applications in semiconductor microelectronics, such as laser dye etching of ICs. Femtosecond-pulse laser pulses have been shown to hold great potential for high-precision micromachining. The extremely short duration of a femtosecond pulse highly limits heat diffusion, resulting in clean and defect-free ablation, making highprecision micromachining achievable.
B. K. A. Ngoi, Krishnan Venkatakrishnan, Beng Heok Tan, "Submicron holes in copper thin film directly ablated using femtosecond pulsed laser," Optical Engineering 40(12), (1 December 2001). http://dx.doi.org/10.1117/1.1419024
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KEYWORDS
Copper

Femtosecond phenomena

Laser ablation

Pulsed laser operation

Thin films

Scanning electron microscopy

Laser systems engineering

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