1 August 2001 Coplanarity study on ball grid array packaging
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Abstract
We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two- channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing.
© (2001) Society of Photo-Optical Instrumentation Engineers (SPIE)
Cho Jui Tay, Cho Jui Tay, Xiaoyuan He, Xiaoyuan He, Xin Kang, Xin Kang, Chenggen Quan, Chenggen Quan, Huai Min Shang, Huai Min Shang, } "Coplanarity study on ball grid array packaging," Optical Engineering 40(8), (1 August 2001). https://doi.org/10.1117/1.1386639 . Submission:
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