Laser writing using conventional lasers has found widespread application in the fabrication of electronic components and the repair of integrated circuits. However, due to large thermal damage associated with the laser ablation process, these lasers are not suitable for microelectronic components with submicron feature size. To address these issues, a novel system is introduced for laser direct writing using femtosecond lasers. Here, an acousto-optic deflector-based scanning system has been developed for steering the femtosecond laser beam with high positional accuracy, resolution, and scan speed. The capability of the system to machine complex features with submicron line widths has been proved. This system has profound potential application in the electronic and microfabrication industry.