1 December 2003 Optical sensor for semiconductor chip bonding
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Optical Engineering, 42(12), (2003). doi:10.1117/1.1625379
Abstract
A through-beam configuration optical sensor is designed, fabricated, and tested for chip bonding. The tip taper angle was designed based on a cone condensor theory for maximal optical power collection at the tip's output. Experiments conducted to determine the optical power collected using a series of tip taper angles confirm the general applicability of the cone condenser theorem. The optical sensor was found to perform extremely well when incorporated in an actual chip bonding machine, where chips of 3.4×3.4 mm in dimension were tested.
Tuck Wah Ng, C.W. Ng, "Optical sensor for semiconductor chip bonding," Optical Engineering 42(12), (1 December 2003). https://doi.org/10.1117/1.1625379
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