1 September 2003 Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects
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Optical Engineering, 42(9), (2003). doi:10.1117/1.1599839
Abstract
We demonstrate a chip-scale micro-optical interconnect. The prototype system for this demonstration consists of optoelectronic transmitter and receiver multichip modules. A diffractive optical element (DOE) is used for optically interconnecting the multichip modules and in establishing a point-to-point link. The link length, as measured from the optical source of the transmitter to the detector plane of the receiver, is only 2.332 mm. The transmitter and receiver module dimensions as well as the integrated system volume are comparable to very large scale integration (VLSI). The design, fabrication, integration of this system, and experimental results are presented.
Saurabh K. Lohokare, Dennis W. Prather, Jeffery A. Cox, Paul E. Sims, Michael G. Mauk, Oleg V. Sulima, "Integrated optoelectronic transmitter and receiver multi-chip modules for three-dimensional chip-level micro-optical interconnects," Optical Engineering 42(9), (1 September 2003). http://dx.doi.org/10.1117/1.1599839
JOURNAL ARTICLE
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KEYWORDS
Transmitters

Diffractive optical elements

Receivers

Optoelectronics

Vertical cavity surface emitting lasers

Gallium arsenide

System integration

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