1 November 2004 10-Gbytes/s, three-dimensional parallel optical interconnects using a novel conductive polymer flip-chip process
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Abstract
Micro-optics offers the ability to realize massively parallel, surface-normal interconnects at the chip scale. In this context, we investigate the integration of a 10-Gbytes/s, 850-nm vertical-cavity surface-emitting laser (VCSEL) with a 2×2 array of continuous surface profile, diffractive optical elements to demonstrate a prototype system that incorporates 3-D, highly dense, parallel optical interconnects. The integration is achieved using a novel conductive polymer-based flip-chip process, which is implemented using conventional fabrication techniques. We present experimental results from the design, fabrication, integration, and characterization of the prototype system.
© (2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Saurabh K. Lohokare, Saurabh K. Lohokare, Christopher A. Schuetz, Christopher A. Schuetz, Zhaolin Lu, Zhaolin Lu, Thomas E. Dillon, Thomas E. Dillon, Anita Sure, Anita Sure, Dennis W. Prather, Dennis W. Prather, } "10-Gbytes/s, three-dimensional parallel optical interconnects using a novel conductive polymer flip-chip process," Optical Engineering 43(11), (1 November 2004). https://doi.org/10.1117/1.1803555 . Submission:
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