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1 December 2004 Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications
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A simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes with no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated by conventional PCB processes at a temperature of 180°C for 1 h under 47 kg/cm2 of pressure. The 50/125-µm glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about ±5 µm. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than ±0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated.
©(2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Han Seo Cho, Saekyoung Kang, Byung Sup Rho, Hyo-Hoon Park, Kyoung Up Shin, Sang Won Ha, Byoung Ho Rhee, Dong Su Kim, Sun Tae Jung, and Taeil I. Kim "Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications," Optical Engineering 43(12), (1 December 2004).
Published: 1 December 2004

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