1 December 2004 Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications
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A simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes with no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated by conventional PCB processes at a temperature of 180°C for 1 h under 47 kg/cm2 of pressure. The 50/125-µm glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about ±5 µm. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than ±0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated.
© (2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Han Seo Cho, Han Seo Cho, Saekyoung Kang, Saekyoung Kang, Byung Sup Rho, Byung Sup Rho, Hyo-Hoon Park, Hyo-Hoon Park, Kyoung Up Shin, Kyoung Up Shin, Sang Won Ha, Sang Won Ha, Byoung Ho Rhee, Byoung Ho Rhee, Dong Su Kim, Dong Su Kim, Sun Tae Jung, Sun Tae Jung, Taeil I. Kim, Taeil I. Kim, } "Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications," Optical Engineering 43(12), (1 December 2004). https://doi.org/10.1117/1.1810530 . Submission:

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