1 April 2004 Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern
Author Affiliations +
Abstract
An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (λ= 10.6 μm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a whole-field map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.
Michael Mello, Bongtae Han, Zhaoyang Wang, "Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern," Optical Engineering 43(4), (1 April 2004). https://doi.org/10.1117/1.1666861
JOURNAL ARTICLE
7 PAGES


SHARE
Back to Top