1 April 2004 Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern
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Abstract
An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (λ= 10.6 μm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a whole-field map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.
© (2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Michael Mello, Michael Mello, Bongtae Han, Bongtae Han, Zhaoyang Wang, Zhaoyang Wang, } "Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern," Optical Engineering 43(4), (1 April 2004). https://doi.org/10.1117/1.1666861 . Submission:
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