1 May 2004 Realization of regular fiber bundles with defined pitch
Author Affiliations +
We show a technology to overcome a known bottleneck in the communication between processor and memory or, especially in multiprocessor systems, among the processors themselves. The solution is communication with the help of fiber bundles with defined pitch. The disadvantages of microstructures based on poly-methyl-meth-acrylate are described. Attractive alternatives based on silicon for precisely structured elements are explained. A practical example of a fiber array is visualized.
Lutz Hoppe, "Realization of regular fiber bundles with defined pitch," Optical Engineering 43(5), (1 May 2004). https://doi.org/10.1117/1.1690283


Data volume analysis of a 100+ Gb s LEO to...
Proceedings of SPIE (February 15 2018)
Application of mesh network radios to UGS
Proceedings of SPIE (April 03 2008)
Bit Error Rate Testing Of Quadrant Photodetectors
Proceedings of SPIE (June 02 1989)
1Gb s transmission of GI HCS fiber with crimp and...
Proceedings of SPIE (November 29 2011)
UWIN: a universal wireless infrared network system
Proceedings of SPIE (September 18 1995)

Back to Top