1 May 2005 Ultraviolet laser ablation patterning of oxide films for optical applications
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Optical Engineering, 44(5), 051108 (2005). doi:10.1117/1.1904602
Abstract
Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO2, Al2O3, HfO2, and Ta2O5 layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings.
Jürgen Ihlemann, "Ultraviolet laser ablation patterning of oxide films for optical applications," Optical Engineering 44(5), 051108 (1 May 2005). http://dx.doi.org/10.1117/1.1904602
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KEYWORDS
Laser ablation

Ultraviolet radiation

Oxides

Excimer lasers

Optical lithography

Hybrid fiber optics

UV optics

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