1 January 2006 New thermally isolated pixel structure for high-resolution (640×480) uncooled infrared focal plane arrays
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Abstract
A new pixel structure with twice-bent beams and eaves structure, suitable for high-resolution uncooled infrared (IR) focal plane arrays (FPAs), is proposed. In comparison with previous results (FPA of 37-µm pixel pitch), the thermal conductance of the test device with the proposed pixel structure of 23.5-µm pitch is reduced about 2.5 times. The eaves structure, which is adopted to increase the fill factor of pixels, improves the responsivity by a factor of 1.3. A 640×480 bolometer-type uncooled IRFPA is demonstrated by utilizing the new pixel structure, with supplementary modification to improve thermal conductance and thermal time constant. It shows a noise equivalent temperature difference (NETD) of 50 mK for F/1.0 optics at 30 frames/sec, a thermal conductance of 0.03 µW/K, and a thermal time constant of 16 msec.
Shigeru Tohyama, Masaru Miyoshi, Seiji Kurashina, Nobukazu Ito, Tokuhito Sasaki, Akira Ajisawa, Yutaka Tanaka, Akihiro Kawahara, Kiyoshi Iida, Naoki Oda, "New thermally isolated pixel structure for high-resolution (640×480) uncooled infrared focal plane arrays," Optical Engineering 45(1), 014001 (1 January 2006). https://doi.org/10.1117/1.2151892
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