For reducing the material consumption of optical waveguides for chip-scale optical interconnects, we propose a material-saving optical waveguide fabrication process based on light-assisted selectively occupied repeated transfer (LA SORT). LA SORT enables device elements to be selectively transferred onto a substrate with designed arrangements at one time, using all-photolithographic methods. In the proposed process, optical waveguides are fabricated by transferring cores selectively onto final substrates from a picking-up substrate, on which a high-density core array is placed. Since one picking-up substrate can provide cores to a plurality of final substrates, drastic reduction of waveguide material consumption is expected. The process can also construct complete air-cladding waveguides for fine-pattern optical interconnects. By LA SORT, using films coated with UV-curable material, selective transfers of polymer device elements were achieved. A selective transfer of 32-μm-wide, 3-cm-long polymer cores duplicated by the built-in mask method was demonstrated to provide the proof of concept of the process. We also succeeded in fabricating 4-μm-wide polymer cores with tapered mirrors, and making air-cladding waveguides by transferring the cores. Possible applications of the proposed process to nanoscale optical circuit integration are discussed.